The GOOD DIE project - A KGD Action

KNOWN GOOD DIE STANDARD

standards for die products...?

The ENCASIT team are actively involved in the preparation and promotion of standards related to Die Products and System Integration Technologies through membership of IEC committees and project teams.

This is primarily through IEC/PT62258, TC40/WG36 and by providing recommendations to JEDEC standards development.

Involvement in Jisso International Council (JIC) and Jisso Europe (JEC) provides a roadmap of developing standards for the various integration levels of Die Products.

IEC TC47/PT 62258 documents status

IEC 62258-1 Edition 1.0:2005 Semiconductor die products -
Part 1: Requirements for procurement and use Published

IEC 62258-2 Edition 1.0:2005 Semiconductor die products -
Part 2. Exchange data formats
(Also available from BSI as BS EN 62258-2:2005)

Published

IEC/TR 62258-3 Edition 1.0:2005 Semiconductor die products -
Part 3 Recommendations for good practice in handling, packing and storage
(Also available from BSI as PD IEC/TR 62258-3:2005) Published

IEC 62258-4 Semiconductor die products -
Part 4: Questionnaire for die users and suppliers Being circulated
as DTR

IEC 62258-5 Semiconductor die products -
Part 5: Requirements for information concerning electrical simulation Being circulated
as FDIS

IEC 62258-6 Semiconductor die products -
Part 6: Requirements for information concerning thermal simulation Being circulated
as FDIS

IEC 62258-7 Semiconductor die products -
Part 7: XML Schema Being circulated
as CD

TC40 WG36 document status

IEC 60286-3 Edition 4 Packing of surface mount components on continuous tapes -
document reference 40/1606/CDV Voting just finished
on CDV

Where to obtain published Documents

Published IEC documents may be obtained from IEC central office www.iec.ch or from National Standards bodies, where published, for example BSI in the UK.

All the parts of the 62258 series are being published also in Europe as http://www.cenelec.org EN documents and should therefore be available in due course from each member state National Standards body.

Electronic versions of published documents may also be bought from the IEC web site at www.iec.ch

Die Data Definitions and Glossary of Terms

Definitions of all the Die Products specific items listed in parts 1 and 2 of the IEC 62258 standards have been included in IEC61360, the IEC Data Dictionary, which is available online at http://dom2.iec.ch/iec61360

There is also a glossary maintained by the IEC which contains basic definitions of all common terms used, including the Die Products items that have been compiled during preparation of the IEC 62258 series of documents.

This glossary is available at
http://std.iec.ch/terms/terms.nsf/ByTC?OpenView&Count=-1&RestrictToCategory=47

Roadmaps & Networks

ITRS Roadmap - International Technology Roadmap for Semiconductors

JEC - JISSO European Council

JIC - JISSO International Council

IEC 62258-1 Edition 1.0:2005 Semiconductor die products - Part 1: Requirements for procurement and use	Published
IEC 62258-2 Edition 1.0:2005 Semiconductor die products - Part 2. Exchange data formats (Also available from BSI as BS EN 62258-2:2005)	Published
IEC/TR 62258-3 Edition 1.0:2005 Semiconductor die products - Part 3 Recommendations for good practice in handling, packing and storage (Also available from BSI as PD IEC/TR 62258-3:2005)	Published
IEC 62258-4 Semiconductor die products - Part 4: Questionnaire for die users and suppliers	Being circulated as DTR
IEC 62258-5 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation	Being circulated as FDIS
IEC 62258-6 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation	Being circulated as FDIS
IEC 62258-7 Semiconductor die products - Part 7: XML Schema	Being circulated as CD